基本信息
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Career Trajectory
Bio
Damena Agonafer (Member, IEEE) received the Ph.D. degree from the University of Illinois at Urbana–Champaign, Urbana, IL, USA, in 2012.
After his Ph.D. degree, he joined Professor Ken Goodson’s Nanoheat lab as a Postdoctoral Scholar in the Mechanical Engineering Department, Stanford University, Stanford, CA, USA. He is currently an Assistant Professor with the Mechanical Engineering and Materials Science Department, Washington University in St. Louis, St. Louis, MO, USA, where he is also a Faculty Advisor with the Institute of Materials Science and Engineering and an Advisor to the National Science of Black Engineers Local WashU Chapter. His research interest is at the intersection of thermal-fluid sciences, electrokinetics and interfacial transport phenomena, and renewable energy.
Dr. Agonafer was a recipient of the Google Research Award, the Sloan Research Fellowship Award, the Cisco Research Award, the NSF CAREER Award, and the American Society of Mechanical Engineer’s Early Career Award. As a Ph.D. candidate at the University of Illinois at Urbana–Champaign, he was a recipient of the Alfred P. Sloan Fellowship Award. Most recently, he was one of 85 early career engineers selected to attend the 2021 National Academy of Engineering’s 26th Annual U.S. Frontiers of Engineering Symposium.
Research Interests
Papers共 42 篇Author StatisticsCo-AuthorSimilar Experts
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Andoniaina M. Randriambololona, Vivek Manepalli, Rachel C. McAfee, Bidisha Ojha, Rahi Miraftab-Salo,Kidus Guye,Hyoungsoon Lee,Samuel Graham,Damena Agonafer
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2024): 1-1
International Journal of Mechanical Sciences (2023): 108228-108228
Journal of Electronic Packagingno. 1 (2023)
Vivek V. Manepalli,Kidus Guye,Erdong Song, Alex Dutton, Daniel Luberda,Quan Chau,Yousof Nayfeh, Troy Beechner,Sean H. Hoenig,Michael C. Ellis,Damena D. Agonafer
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)pp.1-10, (2022)
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 10 (2021): 1583-1591
2021 37th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)pp.88-94, (2021)
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