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Papers共 21 篇Author StatisticsCo-AuthorSimilar Experts
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2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)pp.244-249, (2022)
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1323-1328, (2022)
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)pp.1-3, (2022)
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposiumpp.967-972, (2021)
Biao Car,Jose Hejase,Kevin Mcilvain,Kyle Giesen, Zhaoqin Chen,Hongqing Zhang,Junyan Tang,Megan Nguyen, Devon Baughen,Daniel Dreps,Brian Connolly,Glen Wiedemeier,
2018 IEEE SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, SIGNAL INTEGRITY AND POWER INTEGRITY (EMC, SI & PI)pp.1-1, (2018)
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)pp.379-384, (2018)
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