Craig L. Keast

Craig L. Keast received the B.A. degree from Hamilton College, Clinton, NY, and the S.M., E.E., and Ph.D. degrees in electrical engineering and computer science from Massachusetts Institute of Technology (MIT), Cambridge. He is currently the Associate Head of the Solid State Division and the Director of Operations for the Microelectronics Laboratory, Lincoln Laboratory, MIT, Lexington. From 1981 to 1988, he was with Lincoln Laboratory, where he worked on semiconductor processing and technology development for the Digital Wafer-Scale Electronics Group. After completing the Ph.D. degree, in 1992, he returned to Lincoln Laboratory, where he first worked with the Submicrometer Technology Group on deeply scaled device development using advanced optical lithography techniques. His current research interests include deep-submicrometer low-power CMOS process development, RF and optical MEMS, and 3-D circuit integration technologies.