基本信息
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Bio
C. P. Hung received the Ph.D. degree in electrical and electronic engineering from the University of Paisley, Paisley, U.K.
He has more than 20 years of research focusing on product developed featuring integrated design technologies, and a broad range of advanced chip, package, and system integration solutions. He is currently the Vice President with Corporate Research and Development, ASE Holdings Inc., Kaohsiung, Taiwan, where he leads the team responsible for the next-generation product development to be rolled out to various ASE manufacturing sites. He has authored or coauthored more than 50 technical publications of SCI journal and international conference papers and also the inventor of more than 70 patents in multiple countries.
Dr. Hung has been a SEMI Taiwan PKG & TEST Committee Chair since 2013.
Research Interests
Papers共 21 篇Author StatisticsCo-AuthorSimilar Experts
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2021 International Conference on Electronics Packaging (ICEP)pp.93-94, (2021)
International Symposium on Microelectronicsno. 1 (2021): 000228-000233
Ian Hu,Hung-Hsien Huang, Po-Cheng Huang,Jui-Cheng Yu,Chien-Neng Liao,Meng-Kai Shih,David Tamg,CP Hung
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Author Statistics
#Papers: 18
#Citation: 214
H-Index: 5
G-Index: 13
Sociability: 4
Diversity: 2
Activity: 1
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