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个人简介
Chi-Chun Chen received the B.S., M.S., and Ph.D. degrees in electronics engineering from the National Chiao Tung University (NCTU), Taiwan, R.O.C., in 1996, 1997, and 2000, respectively.
At NCTU, his research was focused on the process-related oxide reliability of ultrathin gate oxides. In 2000, he joined the Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, Taiwan, R.O.C., where he was responsible for the HDPCVD process for STI and ILD gapfill, thin gate oxide process, and Cu CMP process for 0.13-$\mu\hbox{m}$ logic process development in the 300-mm pilot line. From 2001 to 2004, he worked on the research and development of advanced gate stack process. He is currently the Project Manager of the Advanced Module Technology Division of the R&D organization. He is responsible for gate stack module development, including wet clean and surface preparation, thermal process, oxynitride/poly gate stack process, and related metrology technologies. He has authored or coauthored about 40 technical papers in the advanced semiconductor process area, especially in gate dielectrics-related process. He also holds more than ten patents in semiconductor manufacturing technologies.
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Journal of Crystal Growthpp.127762, (2024)
JOURNAL OF CRYSTAL GROWTH (2024): 127474-127474
Chun-An Chen,Po-Han Chen, Yu-Xiang Zheng,Chiao-Han Chen, Mong-Kai Hsu, Kai-Chieh Hsu,Ying-Yu Lai,Chih-Sung Chuu,Hui Deng,Yi-Hsien Lee
NANO LETTERSno. 11 (2024): 3395-3403
IEEE Transactions on Services Computingno. 99 (2024): 1-14
SMALLno. 17 (2024): e2307728-e2307728
RESULTS IN PHYSICS (2024): 107255
Lian-Ming Lyu, Han-Jung Li, Ren-Shiang Tsai,Ching-Feng Chen,Yu-Chung Chang,Yu-Chun Chuang, Cheng-Shiuan Li,Jeng-Lung Chen,Te-Wei Chiu,Chun-Hong Kuo
ACS applied materials & interfacesno. 21 (2024): 27329-27338
2023 ASIA-PACIFIC MICROWAVE CONFERENCE, APMCpp.273-275, (2023)
Po-Ting Lai,Cheng-Yueh Chen,Hao-Cheng Lin, Bo-Yuan Chuang,Kai-Hua Kuo,Christopher R. Greve,Tsung-Kai Su,Guang-Hsun Tan,Chia-Feng Li, Sheng-Wen Huang,Kai-Yuan Hsiao,Eva M. Herzig,
ACS NANOno. 24 (2023): 25552-25564
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