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Bio
Perceval Coudrain received the M.S. degree in materials sciences from the University of Nantes, Nantes, France, in 2001, and the Ph.D. degree from the Institut Supérieur de ’Aéronautique et de l’Espace, Toulouse, France, in 2009.
He joined STMicroelectronics, Crolles, France, in 2002, and entered the advanced research and development group in 2005, where he was involved in the development of backside illumination and monolithic 3D integration for CMOS image sensors. For ten years, he has been focusing on 3D integration technologies, including TSV and C–Cu hybrid bonding, and thermal management. He moved to CEA-Leti, Grenoble, France, in 2018, where his research focuses on 3D integration, fan-out wafer level packaging, and embedded microfluidics.
Research Interests
Papers共 79 篇Author StatisticsCo-AuthorSimilar Experts
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Arnaud Garnier,Laetitia Castagné,Stéphane Moreau,Alexandra Fraczkiewicz, Théo Monniez,Daniel Mermin, Suzanne Guillou,Laura Vauche,Damien Saint-Patrice,Perceval Coudrain
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1649-1656, (2024)
Aurelia Plihon,Edouard Deschaseaux,Remi Franiatte,Jerome Dechamp, Simon Vaudaine,Jennifer Guillaume, Catherine Brunet-Manquat,Stephane Moreau,Perceval Coudrain
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.2122-2127, (2022)
Perceval Coudrain,Arnaud Garnier,Laetitia Castagné,Aurélia Plihon,Rémi Vélard,Rémi Franiatte,Jean-Charles Souriau, Jeanne Pignol, Célia Darrambide, Emmanuel Ollier
ECS Transactionsno. 2 (2022): 3-14
Energy (2022): 123984-123984
Sylvain Misat, Mikhail Loktev, Ralph Schiedon,Jeroen De Boeij,Michiel van der Stam, Chia–Ching Huang,Pierre Sixt,Haidar Al Dujaili,Tristan Dewolf,Nacima Allouti,Laurent Pain,Cyril Vannuffel,
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)pp.867-872, (2022)
Mikhail Loktev, Sylvain I. Misat, Ralph Schiedon,Jeroen de Boeij,Michiel van der Stam,Pierre Sixt,Haidar Al Dujaili,Tristan Dewolf,Nacima Allouti,Laurent Pain,Cyril Vannuffel,Perceval Coudrain,
2022 Smart Systems Integration (SSI)pp.1-6, (2022)
Arnaud Garnier,Laetitia Castagne, Florent Greco, Thomas Guillemet,Laurent Marechal,Mehdy Neffati,Remi Franiatte,Perceval Coudrain,Stephane Piotrowicz,Gilles Simon
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.2016-2023, (2021)
2020 IEEE INTERNATIONAL SOLID- STATE CIRCUITS CONFERENCE (ISSCC)pp.46-+, (2020)
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Author Statistics
#Papers: 79
#Citation: 1250
H-Index: 22
G-Index: 33
Sociability: 6
Diversity: 2
Activity: 4
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