基本信息
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个人简介
C. T. Wang received the B.S. and M.S. degrees in materials science and engineering from National Tsing Hua University, Hsinchu, Taiwan, in 1983 and 1985, respectively, and the Ph.D. degree from Stanford University, Stanford, CA, USA, in 1997.
In 2000, he joined USI, Nantou city, Taiwan, and led EE and packaging team for wireless connectivity SiP module design using miniaturization technology. In 2011, he joined TSMC, Hsinchu, Advanced Packaging Research and Development.
研究兴趣
论文共 37 篇作者统计合作学者相似作者
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1093-1097, (2024)
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.296-301, (2023)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1-4, (2023)
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)pp.1-4, (2023)
Douglas C. H. Yu,Chuei-Tang Wang, Chia-Chia Lin,Chih-Hsin Lu,Gene Wu, Chien-Yuan Huang,Wei-Ting Chen,Terry Ku,Kuo-Chung Yee,Chung-Hao Tsai
IEEE TRANSACTIONS ON ELECTRON DEVICESno. 12 (2022): 7167-7172
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.263-268, (2021)
2021 IEEE International Electron Devices Meeting (IEDM) (2021)
Tzu-Chun Tang,Doug Yu, Chia-Chia Lin,Che-Wei Hsu, Chun-Lin Lu,Chung-Hao Tsai,Kai-Chiang Wu,Han-Ping Pu,Chung-Shi Liu,Chuei-Tang Wang
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作者统计
#Papers: 37
#Citation: 742
H-Index: 21
G-Index: 26
Sociability: 4
Diversity: 1
Activity: 0
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