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Research Interests

Papers共 51 篇Author StatisticsCo-AuthorSimilar Experts

By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
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期刊级别
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Alignment Between Subsequent 3D Molding Layers for Optimized Performance of 3D Integrated Patch Antennas for Advanced Sensing Applications
Nyake Gahein-Sama,Marc Dreissigacker, Friedrich Müller,Christian Tschoban,Tanja Braun,Karl-Friedrich Becker,Martin Schneider-Ramelow
2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)pp.1-7, (2024)
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Surface Manipulation of Ag Metallization to Improve the Adhesion Strength for Soldering Applications on LTCC
C. Kleinholz, B. Müller,M. Fischer,C. Tschoban, J.-M. Köszegi, H. Pötter,I. Ndip,M. Schneider-Ramelow, J. Müller
2024 International Conference on Electronics Packaging (ICEP)pp.209-210, (2024)
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Investigation of Cavity Fabrication Methods for Integrated Horn Antenna Structures in Low Temperature Cofired Ceramic (LTCC) Substrates
Cathleen Kleinholz, Bjorn Muller, Michael Fischer,Marc Dreissigacker, Oliver Nallaweg,Christian Tschoban,Karl-Friedrich Becker,Martin Schneider-Ramelow,Jens Muller
Journal of Microelectronics and Electronic Packagingno. 4 (2024)
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3D Comform Radar System for Detection of Motion and Falls in Spatial Application
Christian Tschoban,Paul Perlwitz, Joseph Hamani,Harald Pötter, Joao Marques,Christine Kallmayer,Ivan Ndip,Martin Schneider-Ramelow
2023 Smart Systems Integration Conference and Exhibition (SSI)pp.1-4, (2023)
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3D Freeform Antenna-in-Package Approach for FOWLP
Tanja Braun,Tina Thomas,Karl-Friedrich Becker,Thi Huyen Le,Christian Tschoban,Rolf Aschenbrenner, Marc Dreissigcker,Martin Schneider-Ramelow
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.247-252, (2023)
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Analysis of the Influences of PCB Process Tolerances and Assembly Tolerances on 60 GHz Radar Sensor for Radar Toolkit
Christian Tschoban,Harald Pötter, Lukas Becker,Paul Perlwitz, Carsten Brockmann, Mike Groß,Ivan Ndip,Martin Schneider-Ramelow
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.266-272, (2023)
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Analysis and Characterization of Castellated Holes As RF Interconnects for Modular Millimeter-Wave Devices
Paul Perlwitz,Tschoban Christian,Ndip Ivan,Pøtter Harald,Schneider-Ramelow Martin
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)pp.1-7, (2023)
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Author Statistics

#Papers: 51

#Citation: 312

H-Index: 9

G-Index: 17

Sociability: 5

Diversity: 2

Activity: 3

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