shangchih chen - AI Profile | 人才画像

基本信息

浏览量：0

职业迁徙

个人简介

暂无内容

研究兴趣

论文共 216 篇作者统计合作学者相似作者

按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选

Atomic excitation delocalization at the clean to disordered interface in a chirally-coupled atomic array

C. -C. Wu,K. -T. Lin, I. G. N. Y. Handayana, C. -H. Chien, S. Goswami,G. -D. Lin,Y. -C. Chen,H. H. Jen

PHYSICAL REVIEW RESEARCHno. 1 (2024): 013159

引用0浏览0引用

A Thermally Friendly Bonding Scheme for 3D System Integration

Gordon Kuo,Chih-Yuan Chen,Cheng-Chieh Hsieh, Chung-Ju Lee,Jason Wu,Ji James Cui, Yen-Liang Kuo, Chih- Hang Tug,Terry Ku,Chung-Hao Tsai,Kuo-Chung Yee,Douglas C. N. Yu

2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1973-1976, (2023)

引用0浏览0EIWOS引用

Characterizing and Reducing the Layout Dependent Effect and Gate Resistance to Enable Multiple-Vt Scaling for a 3nm CMOS Technology

C. A. Lu, H. P. Lee,H. C. Chen,Y. C. Lin, Y. H. Chung,S. H. Wang,J. Y. Yeh,V. S. Chang,M. C. Chiang,W. Chang, H. C. Chung, C. F. Cheng,

VLSI Technology and Circuitspp.1-2, (2023)

引用0浏览0EIWOS引用

Energy Efficient Computing With High-Density, Field-Free STT-Assisted SOT-MRAM (SAS-MRAM)

William Hwang,Fen Xue,Fan Zhang,Ming-Yuan Song,Chien-Min Lee,Emrah Turgut,T. C. Chen,Xinyu Bao,Wilman Tsai,Deliang Fan,Shan X. Wang

IEEE Transactions on Magnetics（2023）

引用3浏览0EIWOS引用

How Fault-Tolerant Quantum Computing Benefits from Cryo-CMOS Technology

H.-L. Chiang, R. A. Hadi, J.-F. Wang, H.-C. Han,J.-J. Wu, H.-H. Hsieh,J.-J. Horng,W.-S. Chou, B.-S. Lien,C.-H. Chang,Y.-C. Chen,Y.-H. Wang,

VLSI Technology and Circuitspp.1-2, (2023)

引用1浏览0EIWOS引用

Investigation of LowK WLCSP Die Strength Impact induced by Singulation Process

C. C. Chen,Y. S. Wu,K. H. Chen, W. S. Tseng,P. H. Tsao, S. T. Leu

IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1025-1029, (2022)

引用0浏览0EIWOS引用

A 3nm CMOS FinFlex (TM) Platform Technology with Enhanced Power Efficiency and Performance for Mobile SoC and High Performance Computing Applications

Shien-Yang Wu,C. H. Chang,M. C. Chiang,C. Y. Lin,J. J. Liaw,J. Y. Cheng,J. Y. Yeh,H. F. Chen,S. Y. Chang, K. T. Lai,M. S. Liang,K. H. Pan,

2022 INTERNATIONAL ELECTRON DEVICES MEETING, IEDM（2022）

引用1浏览0EIWOS引用

Interfacial-Layer Design for Hf1-xZrxO2-Based FTJ Devices: From Atom to Array

H. -L. Chiang, J.-F. Wang, K. -H. Lin,C.-H. Nien,J. -J. Wu,K.-Y. Hsiang,C. -P. Chuu,Y.-W. Chen, X. W. Zhang,C. W. Liu,Tahui Wang,C. -C. Wang,

2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)pp.361-362, (2022)

引用1浏览0EIWOS引用

A > 64 Multiple States and > 210 TOPS/W High Efficient Computing by Monolithic Si/CAAC-IGZO + Super-Lattice ZrO2/Al2 O3/ZrO2 for Ultra-Low Power Edge AI Application

M. -C. Chen,S. Ohshita, S. Amano,Y. Kurokawa, S. Watanabe, Y. Imoto, Y. Ando, W. -H. Hsieh,C. -H. Chang,C. -C. Wu,S. -S. Chuang, H. Yoshida,

2022 INTERNATIONAL ELECTRON DEVICES MEETING, IEDM (2022)

引用0浏览0引用

Endurance > 10¹¹ Cycling of 3D GAA Nanosheet Ferroelectric FET with Stacked HfZrO2 to Homogenize Corner Field Toward Mitigate Dead Zone for High-Density eNVM

C.-Y. Liao,K.-Y. Hsiang,Z. -F. Lou,H.-C. Tseng,C.-Y. Lin,Z.-X. Li,F.-C. Hsieh,C.-C. Wang,F.-S. Chang,W.-C. Ray,Y.-Y. Tseng,S. T. Chang,

2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)pp.1-2, (2022)

引用0浏览0EIWOS引用

加载更多

作者统计

合作学者

合作机构

D-Core

合作者
学生
导师

暂无相似学者，你可以通过学者研究领域进行搜索筛选

数据免责声明

页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果，我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问，可以通过电子邮件方式联系我们：report@aminer.cn