Prof. Chih Chen is currently the chair professor in Dept. of Materials Science and Engineering, National Yang Ming Chiao Tung University (NYCU). His current research interests are low-temperature Cu-to-Cu direct bonding, high strength nanotwinned Cu lines and films for 3D IC integration, reliabilities of flip-chip solder joints and microbumps for microelectronics packaging, including electromigration, thermomigration, and metallurgical reactions. He published 200+ journal papers and he holds 35+ Taiwan and US patents. He wrote a book with Prof. King-Ning Tu and Prof. H.M. Chen on Electronic Packaging Science and Technology, which has been published by Wiley in 2021.