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个人简介
Chien-Lung Liang received the B.S., M.S., and Ph.D. degrees in materials science and engineering from National Cheng Kung University, Tainan, Taiwan, in 2013, 2014, and 2019, respectively.
He has been a Post-Doctoral Research Fellow with the Electronic Packaging Laboratory (Advisor: Prof. Kwang-Lung Lin), Department of Materials Science Engineering, National Cheng Kung University, since 2019. He is currently engaged in the research projects of electromigration in electronic materials and development of high-temperature Pb-free solders. He is the author of 13 journal articles and 1 conference proceeding. His research interests include electromigration in electronic materials, interfacial reaction in solder interconnects, intermetallic compound (IMC) characterizations, development of high-temperature Pb-free solders, and materials characterization.
研究兴趣
论文共 28 篇作者统计合作学者相似作者
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Surface and Coatings Technologypp.130828, (2024)
Materials (Basel, Switzerland)no. 22 (2023)
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.326-332, (2023)
SSRN Electronic Journal (2022): 114586
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)pp.330-334, (2022)
Social Science Research Network (2022)
Chien-Lung Liang, Min-Yan Tsai,Yung-Sheng Lin,I-Ting Lin, Sheng-Wen Yang,Min-Lung Huang,Jen-Kuang Fang,Kwang-Lung Lin
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)pp.327-333, (2021)
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2020): 138689
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