基本信息
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Bio
Chi-Chun Chen received the B.S., M.S., and Ph.D. degrees in electronics engineering from the National Chiao Tung University (NCTU), Taiwan, R.O.C., in 1996, 1997, and 2000, respectively.
At NCTU, his research was focused on the process-related oxide reliability of ultrathin gate oxides. In 2000, he joined the Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, Taiwan, R.O.C., where he was responsible for the HDPCVD process for STI and ILD gapfill, thin gate oxide process, and Cu CMP process for 0.13-$\mu\hbox{m}$ logic process development in the 300-mm pilot line. From 2001 to 2004, he worked on the research and development of advanced gate stack process. He is currently the Project Manager of the Advanced Module Technology Division of the R&D organization. He is responsible for gate stack module development, including wet clean and surface preparation, thermal process, oxynitride/poly gate stack process, and related metrology technologies. He has authored or coauthored about 40 technical papers in the advanced semiconductor process area, especially in gate dielectrics-related process. He also holds more than ten patents in semiconductor manufacturing technologies.
Research Interests
Papers共 678 篇Author StatisticsCo-AuthorSimilar Experts
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Journal of Crystal Growthpp.127762, (2024)
IEEE Transactions on Services Computingno. 99 (2024): 1-14
SMALLno. 17 (2024): e2307728-e2307728
RESULTS IN PHYSICS (2024): 107255
ACS applied materials & interfacesno. 21 (2024): 27329-27338
2023 ASIA-PACIFIC MICROWAVE CONFERENCE, APMCpp.273-275, (2023)
SSRN Electronic Journal (2023)
JOURNAL OF ALLOYS AND COMPOUNDS (2023): 171557-171557
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Author Statistics
#Papers: 692
#Citation: 15374
H-Index: 56
G-Index: 92
Sociability: 7
Diversity: 4
Activity: 109
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