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个人简介
Dr. Chenming Hu is called the Father of 3D Transistor for developing the FinFET in 1999. Intel hailed FinFET as the most radical shift in semiconductor technology in over 50 years. Modern computers, smart phones, and the internet all ran on 3D transistor processors.
He received the US National Technology and Innovation Medal from President Obama in 2016. He leads the ongoing development of BSIM, a suite of industry-standard computer models of transistors. University of California has provided BSIM loyalty-free for the global IC industry to design integrated circuits worth well over a trillion US dollars since 1995. IEEE, the world’s largest technical professional organization, presented him its highest award, Medal of Honor, in 2020 for helping to “keep Moore’s Law going over many decades” after lauding him as “Microelectronics Visionary” for “achievements critical to producing smaller yet more reliable and higher-performance integrated circuits” in 2009. The 2013 Kaufman Award cited his “tremendous career of creativity and innovation that fueled the past four decades of the semiconductor industry”.
He received the US National Technology and Innovation Medal from President Obama in 2016. He leads the ongoing development of BSIM, a suite of industry-standard computer models of transistors. University of California has provided BSIM loyalty-free for the global IC industry to design integrated circuits worth well over a trillion US dollars since 1995. IEEE, the world’s largest technical professional organization, presented him its highest award, Medal of Honor, in 2020 for helping to “keep Moore’s Law going over many decades” after lauding him as “Microelectronics Visionary” for “achievements critical to producing smaller yet more reliable and higher-performance integrated circuits” in 2009. The 2013 Kaufman Award cited his “tremendous career of creativity and innovation that fueled the past four decades of the semiconductor industry”.
研究兴趣
论文共 1274 篇作者统计合作学者相似作者
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IEEE TRANSACTIONS ON ELECTRON DEVICESno. 1 (2024): 70-76
Debashish Nandi,Chetan Kumar Dabhi, Dinesh Rajasekaran,Naveen Karumuri, Sreenidhi Turuvekere, Balaji Swaminathan, Srikanth Srihari,Anupam Dutta,Chenming Hu,Yogesh Singh Chauhan
2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)pp.1-3, (2024)
Ayushi Sharma, Yawar Hayat Zarkob,Girish Pahwa,Chetan Kumar Dabhi,Ravi Goel,Harshit Agarwal, Volker Kubrak, Mingchun Tang, Maximilian Treiber,Chenming Hu,Yogesh Singh Chauhan
IEEE Transactions on Electron Devicesno. 99 (2024): 1-7
IEEE TRANSACTIONS ON ELECTRON DEVICESno. 1 (2024): 57-61
Debashish Nandi,Chetan Kumar Dabhi, Dinesh Rajasekaran,Naveen Karumuri, Sreenidhi Turuvekere, Balaji Swaminathan, Srikanth Srihari,Anupam Dutta,Chenming Hu,Yogesh Singh Chauhan
2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (2024)
Biochemical Geneticspp.1-17, (2024)
IEEE ELECTRON DEVICE LETTERSno. 3 (2024): 460-463
Bo-Jheng Shih,Yu-Ming Pan,Hao-Tung Chung, Nein-Chih Lin,Chih-Chao Yang,Po-Tsang Huang,Huang-Chung Cheng,Chang-Hong Shen,Jia-Min Shieh,Wen-Fa Wu,Kuan-Neng Chen,Chenming Hu
JAPANESE JOURNAL OF APPLIED PHYSICSno. 4 (2024)
Yawar Hayat Zarkob,Ayushi Sharma,Girish Pahwa, Debashish Nandi, Chetan K. Dabhi, Volker Kubrak, Bob Peddenpohl, Mingchun Tang,Chenming Hu,Yogesh Singh Chauhan
2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)pp.1-3, (2024)
Chetan Kumar Dabhi,Dinesh Rajasekharan,Girish Pahwa, Debashish Nandi,Naveen Karumuri,Sreenidhi Turuvekere,Anupam Dutta, Balaji Swaminathan, Srikanth Srihari,Yogesh S. Chauhan,Sayeef Salahuddin,Chenming Hu
IEEE TRANSACTIONS ON ELECTRON DEVICESno. 4 (2024): 2284-2292
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