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个人简介
Cheng Zhou received the B.S. degree from Northwestern University, Xi’an, China, in 1991.
He is currently the Vice General Technologist with the Xi’an Institute of Space Radio Technology, Xi’an. His current research interests include chip assembly technology, precision measurement, and image information collection and processing.
Mr. Zhou was a recipient of the third Prize of National Defense Science and Technology Progress for the research on microwave millimeter-wave multichip component assembly technology and the third prize of the Scientific and Technological Progress Award for his research on the miniaturized surface micro-assembly process of transponders.
研究兴趣
论文共 9 篇作者统计合作学者相似作者
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Proceedings of the Eighth Asia International Symposium on Mechatronics Lecture Notes in Electrical Engineeringpp.84-94, (2022)
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)pp.1-5, (2022)
international conference on electronic packaging technologypp.1-6, (2021)
作者统计
#Papers: 9
#Citation: 32
H-Index: 2
G-Index: 5
Sociability: 4
Diversity: 0
Activity: 0
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