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Bio
Cheng Yang (Member, IEEE) received the B.S. degree in electronic science and technology from Wuhan University (WHU), Wuhan, China, in 2009, and the M.S. and Ph.D. degrees in electromagnetic field and microwave technology from the National University of Defense Technology (NUDT), Changsha, China, in 2012 and 2016, respectively.
Since 2019, he has been a Senior Engineer with the Institut für Theoretische Elektrotechnik, Technische Universität Hamburg (TUHH), Hamburg, Germany. From 2013 to 2015, he was funded by the Chinese Scholarship Council (CSC), Beijing, China, as a joint-Ph.D. student at TUHH. From 2017 to 2019, he was a Faculty Member of the State Key Laboratory of Millimeter Wave, Southeast University (SEU), Nanjing, China. His current research interests include computational electromagnetics, microwave measurement techniques, electromagnetic compatibility, and biology electromagnetics.
Research Interests
Papers共 55 篇Author StatisticsCo-AuthorSimilar Experts
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2024 IEEE 28th Workshop on Signal and Power Integrity (SPI)pp.1-4, (2024)
2024 15th German Microwave Conference (GeMiC)pp.181-184, (2024)
2023 IEEE MTT-S INTERNATIONAL MICROWAVE BIOMEDICAL CONFERENCE, IMBIOCpp.7-9, (2023)
2023 International Symposium on Electromagnetic Compatibility – EMC Europepp.1-6, (2023)
2023 IEEE 27th Workshop on Signal and Power Integrity (SPI)pp.1-4, (2023)
2022 IEEE 26th Workshop on Signal and Power Integrity (SPI)pp.1-4, (2022)
2022 International Symposium on Electromagnetic Compatibility – EMC Europepp.467-472, (2022)
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