基本信息
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Bio
Bangtao Chen received the B.Eng. degree in mechanical engineering from the Huazhong University of Science and Technology, Wuhan, China, in 2001, and the Ph.D. degree in MEMS technology from Nanyang Technological University, Singapore, in 2007.
He has been with the Institute of Microelectronics (IME), Agency for Science Technology Research, Singapore, since 2010, and he is currently the Principle Investigator and a Group Leader of MEMS packaging and integration. His current research interests include MEMS process integration, wafer bonding, and de-bonding, wafer level packaging with TSV integration. Prior to joining IME, he was a Post-Doctoral Fellow and a Scientist with research area in microfluidics, BioMEMS, and wafer level packaging since 2005 with the Institute of Bioengineering and Nanotechnology, Singapore.
Research Interests
Papers共 27 篇Author StatisticsCo-AuthorSimilar Experts
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Journal of Micromechanics and Microengineeringno. 3 (2022)
2019 IEEE International Ultrasonics Symposium (IUS)pp.1971-1973, (2019)
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Author Statistics
#Papers: 27
#Citation: 223
H-Index: 9
G-Index: 14
Sociability: 4
Diversity: 2
Activity: 0
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