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Research Interests

Papers共 9 篇Author StatisticsCo-AuthorSimilar Experts

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Influence of Heat Treatment on the Quality of Die-to-Wafer Hybrid Bond Interconnects
Laura Wenzel,Catharina Rudolph, Adil Shehzad,Partha Mukhopadhyay, H. Jim Fulford, Manuela Junghaehnel, Juliana Panchenko
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1830-1836, (2024)
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Annealing Effects in Sub-8 μm Pitch Die-to-Wafer Hybrid Bonding
Partha Mukhopadhyay, Laura Wenzel,Catharina Rudolph, Andrew Tuchman, Kevin Ryan, Adam Gildea, Chris Nichols, John Allgair,Sitaram Arkalgud, Anton deVilliers, Jim Fulford
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1923-1928, (2024)
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Advanced Carriers on Legacy CMP Tools - an Intelligent Solution for Flexible Production Environments and R&D Labs
Knut Christoph Gottfried, Barrie VanDevender, Dan Trojan, Paul Feeney, Ina Schubert, Romy Junghans,Ronny Martinka,Mathias Franz,Catharina Rudolph,Holger Wachsmuth
ECS Meeting Abstractsno. 17 (2016): 1040-1040
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Challenges of TSV backside process integration
Catharina Rudolph,Holger Wachsmuth,Mathias Boettcher,Wolfram Steller,M. Juergen Wolf
2015 International Conference on Planarization/CMP Technology (ICPT)pp.1-4, (2015)
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