基本信息
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Career Trajectory
Bio
Dr. Cadmus Chang-Ann Yuan is currently associate Professor at department of mechanical and computer aid engineering, Feng Chia University in Taichung City, Taiwan. His research interest is developing online machine learning and applying AI methods for Semiconductors Packaging Design, Reliability and Manufacturing. He owns a machine learning platform CAYMAL, where the RNN/LSTM/kNN, and Reinforcement Learning algorithms are implemented with parallel computation.
He is also capable of DSE (discrete event modeling) based factoring modeling for the digitalization towards industry 4.0, especially for the pull manufacturing. He also worked on the molecule dynamics modeling of below-cell-level mechanisms in nano-biology domain.
Specialties: Machine learning, finite element methods, Industry 4.0, molecule dynamics, Solid-State Lighting, MEMS/Electronic Packaging, Strategic Research Agenda, Atomistic/continuum modeling theory. Manufacturing modeling.
Research Interests
Papers共 131 篇Author StatisticsCo-AuthorSimilar Experts
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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-12, (2024)
Microelectronics Reliability (2024): 115416
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-5, (2024)
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-5, (2024)
JOURNAL OF MECHANICS (2023): 183-190
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)pp.137-142, (2023)
Materials (Basel, Switzerland)no. 14 (2023): 4922-4922
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)pp.267-270, (2023)
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-5, (2023)
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