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Papers共 12 篇Author StatisticsCo-AuthorSimilar Experts

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Intel PowerVia Technology: Backside Power Delivery for High Density and High-Performance Computing
Walid M. Hafez, P. Agnihotri,M. Asoro, M. Aykol, B. Bains, R. Bambery, M. Bapna, A. Barik,A. Chatterjee, P. C. Chiu,T. Chu, C. Firby, K. Fischer, M. Fradkin,Hannes Greve,A. Gupta, E. Haralson,M. Haran,Jeffery Hicks, A. Illa,M. Jang,S. Klopcic,M. Kobrinsky, B. Kuns,H.-h. Lai, G. Lanni,S.-H. Lee,N. Lindert, C.-l. Lo,Y. Luo, G. Malyavanatham, B. Marinkovic, Y. Maymon, M. Nabors,J. Neirynck,P. Packan, A. Paliwal,L. Pantisano,Leif Paulson,Padma Penmatsa,Chetan Prasad,Conor Puls,T. Rahman,R. Ramaswamy, S. Samant,Bernhard Sell,K. Sethi, F. Shah,M. Shamanna,K. Shang, Q. Li, M. Sibakoti,J. Stoeger,N. Strutt, R. Thirugnanasambandam,C. Tsai,X. Wang, A. Wang, S.-j. Wu, Q. Xu, X.-h. Zhong,S. Natarajan
2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (2023)
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#Papers: 12

#Citation: 1010

H-Index: 9

G-Index: 11

Sociability: 5

Diversity: 1

Activity: 0

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