基本信息
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Bio
Changze Liu (Member, IEEE) received the Ph.D. degree in electronics engineering from Peking University, Beijing, China, in 2013.
Then, he joined the Semiconductor Division, Samsung Electronics, where he involved in the development of 14/10/7-nm processes. In 2017, he joined Huawei HiSilicon, Shenzhen, China, as technical experts for product R&D in advanced technology node. In 2020, he served as the CEO of Huawei Technologies Research and Development Belgium NV, Leuven, Belgium. He has authored and coauthored over 30 scientific papers, including IEEE IEDM, VLSI, and IRPS.
Dr. Liu served for the Technical Program Committee of IEEE IEDM, EDTM, IRPS, ISCAS, IPFA, and ESREF.
Research Interests
Papers共 136 篇Author StatisticsCo-AuthorSimilar Experts
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Gautam Gaddemane,Pieter Schuddinck, Krishna Bhuwalka,Gerhard Rzepa,Gioele Mirabelli,Anshul Gupta,Jürgen Bömmels,Philippe Matagne,Dmitry Yakimets, Hao Wu, Lei Hou,Geert Hellings,Changze Liu
IEEE Journal of the Electron Devices Societyno. 99 (2024): 1-1
CONFERENCE OF SCIENCE & TECHNOLOGY FOR INTEGRATED CIRCUITS, 2024 CSTIC (2024)
8TH IEEE ELECTRON DEVICES TECHNOLOGY & MANUFACTURING CONFERENCE, EDTM 2024pp.226-228, (2024)
IEEE Journal of the Electron Devices Societyno. 99 (2024): 1-1
crossref(2024)
8TH IEEE ELECTRON DEVICES TECHNOLOGY & MANUFACTURING CONFERENCE, EDTM 2024pp.445-447, (2024)
8TH IEEE ELECTRON DEVICES TECHNOLOGY & MANUFACTURING CONFERENCE, EDTM 2024pp.442-444, (2024)
Mina Bahrami,Dominic Waldhoer,Pedram Khakbaz,Theresia Knobloch, Aftab Nazir,Changze Liu,Tibor Grasser
2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (2023)
The International Archives of the Photogrammetry, Remote Sensing and Spatial Information Sciences (2023)
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Author Statistics
#Papers: 136
#Citation: 900
H-Index: 18
G-Index: 26
Sociability: 6
Diversity: 2
Activity: 5
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