基本信息
浏览量:19
职业迁徙
个人简介
Chun-Hsien Chien received the B.S. degree in chemical from Fu Jen Catholic University, Taipei, Taiwan, in 1995, and the M.S. degree in chemical from National Tsing Hua University, Hsinchu, Taiwan, in 1997.
He had served with the 47th Army Reserved Military Officer for two years since 1997. Since 1999, he has served with United Microelectronics Corporation, Hsinchu, as a Project Leader Engineer in Advanced Etching Module, and is currently a Project Manager with the Department of 3-D Integration Packaging Technology, Electronics and Optoelectronic Research Laboratories, Industrial Technology Research Institute, Hsinchu. His current research interests include wafer-level packaging, embedded active device packaging, and 3-D IC technologies.
研究兴趣
论文共 18 篇作者统计合作学者相似作者
按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
Chun-Hsien Chien,Chien-Chou Chen,Wen-Liang Yeh,Wei-Ti Lin, Cheng-Hui Wu, Fu-Yang Chen, Yi-Cheng Lin, Po-Chiang Wang, Jeng-Ting Li, Bo Cheng Lin,Yu-Hua Chen,Tzyy-Jang Tseng
International Symposium on Microelectronicsno. 1 (2019): 000216-000222
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)no. DPC (2016): 001893-001917
International Symposium on Microelectronicsno. 1 (2016): 000013-000017
International Symposium on Microelectronicsno. 1 (2015): 000724-000728
Electronic Components and Technology Conferencepp.290-296, (2014)
加载更多
作者统计
#Papers: 16
#Citation: 164
H-Index: 9
G-Index: 12
Sociability: 5
Diversity: 1
Activity: 0
合作学者
合作机构
D-Core
- 合作者
- 学生
- 导师
数据免责声明
页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果,我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问,可以通过电子邮件方式联系我们:report@aminer.cn