基本信息
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Bio
Brian Romanczyk received the B.S. and M.S. degrees in microelectronic engineering from the Rochester Institute of Technology, Rochester, NY, USA, in 2012 and 2013, respectively, and the Ph.D. degree in electrical engineering from the University of California at Santa Barbara, Santa Barbara, CA, USA, in 2019.
His current research interests include the design and fabrication of III-nitride materials (III-N) high-electron-mobility transistors (HEMTs) for millimeter-wave power applications.
Research Interests
Papers共 68 篇Author StatisticsCo-AuthorSimilar Experts
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IEEE Microwave and Wireless Technology Lettersno. 2 (2024): 183-186
CRYSTALSno. 6 (2024)
IEEE MICROWAVE AND WIRELESS TECHNOLOGY LETTERSno. 4 (2024): 395-398
2023 IEEE/MTT-S International Microwave Symposium - IMS 2023pp.20-23, (2023)
IEEE TRANSACTIONS ON ELECTRON DEVICESno. 4 (2023): 2075-2080
IEEE MICROWAVE AND WIRELESS TECHNOLOGY LETTERSno. 6 (2023): 683-686
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUESno. 5 (2023): 1932-1944
2022 IEEE/MTT-S International Microwave Symposium - IMS 2022 (2022)
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Author Statistics
#Papers: 68
#Citation: 1431
H-Index: 21
G-Index: 35
Sociability: 5
Diversity: 2
Activity: 7
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