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Yannick Hopf (Graduate Student Member, IEEE) received the B.Sc. and M.Sc. degrees (cum laude) in electrical engineering from the Technical University of Darmstadt, Darmstadt, Germany, in 2014 and 2017, respectively. He is currently pursuing the Ph.D. degree in electrical engineering from the Electronic Instrumentation Laboratory, Delft University of Technology, Delft, The Netherlands, with a focus on application-specific integrated circuit (ASIC) design for 3-D high-frame-rate medical ultrasound imaging.
His current research interests include analog- and mixed-signal integrated circuits for ultrasound imaging, high-voltage electronics, and low-power analog to digital converters.
Mr. Hopf was honored with the Eckelmann AG Price for Best Degree for his M.Sc. graduation.
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论文共 11 篇作者统计合作学者相似作者
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ULTRASOUND IN MEDICINE AND BIOLOGYno. 2 (2024): 285-294
IEEE JOURNAL OF SOLID-STATE CIRCUITSno. 2 (2024): 476-491
ICASSP 2023 - 2023 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP)pp.1-5, (2023)
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Tristan S. W. Stevens, Elizabeth B. Herbst,Ben Luijten,Boudewine W. Ossenkoppele, Thierry J. Voskuil, Shiying Wang,Jihwan Youn, Claudia Errico,Massimo Mischi,Nicola Pezzotti,Ruud J. G. Van Sloun
2022 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IEEE IUS)pp.1-4, (2022)
2022 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IEEE IUS)pp.1-4, (2022)
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