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职业迁徙
个人简介
Areas of expertise:
Heterogeneous integration and advanced electronic packaging
Circuit and system design methodologies - power delivery, communication, thermal aware floorplanning, and test
Energy harvesting in IoT edge devices
Heterogeneous integration and advanced electronic packaging
Circuit and system design methodologies - power delivery, communication, thermal aware floorplanning, and test
Energy harvesting in IoT edge devices
研究兴趣
论文共 43 篇作者统计合作学者相似作者
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Great Lakes Symposium on VLSIpp.1-6, (2024)
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.2229-2236, (2024)
2023 60th ACM/IEEE Design Automation Conference (DAC)pp.1-6, (2023)
IEEE J. Emerg. Sel. Topics Circuits Syst.no. 1 (2023): 96-107
GLSVLSI '23: Proceedings of the Great Lakes Symposium on VLSI 2023pp.267-272, (2023)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1187-1193, (2023)
GLSVLSI '23: Proceedings of the Great Lakes Symposium on VLSI 2023pp.213-214, (2023)
IEEE Transactions on Very Large Scale Integration (VLSI) Systemsno. 3 (2023): 287-295
2023 IEEE 36th International System-on-Chip Conference (SOCC)pp.1-6, (2023)
Advances in Semiconductor Technologiespp.1-24, (2022)
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作者统计
#Papers: 41
#Citation: 246
H-Index: 9
G-Index: 13
Sociability: 4
Diversity: 0
Activity: 1
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