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Research Interests

Papers共 83 篇Author StatisticsCo-AuthorSimilar Experts

By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
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1.6 Tbps (224 Gbps/λ) Silicon Photonic Engine Fabricated with Advanced Electronic-Photonic FOWLP for Co-Packaged Optics and Linear Drive Applications
Xin Li, Sajay B. N. Gourikutty,Jiaqi Wu,Teck Guan Lim,Pengfei Guo, Jaye C. Davies, Edward Sing Chee Koh,Lau Boon Long,Ming Chinq Jong,Chao Li,Guo-Qiang Lo,Surya Bhattacharya,
2024 Optical Fiber Communications Conference and Exhibition (OFC)pp.1-3, (2024)
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Embedded Liquid Cooling of High-Power Microelectronics Using Liquid Metal
Huicheng Feng, Bin He,Gongyue Tang,Xiaowu Zhang,Boon Long Lau, Keng Yuen Jason, Jun Wei Javier Ong,Ming Chinq Jong
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1569-1574, (2024)
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A Compact Wafer-Level Heterogeneously Integrated Scalable Optical Transceiver for Data Centers
Sajay Bhuvanendran Nair Gourikutty, Jiaqi Wu,Teck Guan Lim, San Sandra,Ming Chinq Jong, Chia Lai Yee,Lau Boon Long,David Soon Wee Ho,Chong Ser Choong, Ding Liang, Xiaoguang Tu, Wanjun Wang,
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1398-1403, (2024)
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Direct-Drive 224 Gbps/λ PAM4 and 112 Gbps/λ NRZ Silicon Photonic Transmitter Enabled by FOWLP Electronic-Photonic Integration
Xin Li,Sajay Bhuvanendran Nair Gourikutty, Jiaqi Wu,Teck Guan Lim, Jaye C. Davies, Edward Sing Chee Koh,Lau Boon Long,Chong Ser Choong, San Sandra,Surya Bhattacharya,Jason Tsung-Yang Liow
2024 IEEE Silicon Photonics Conference (SiPhotonics)pp.1-2, (2024)
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Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink
Huicheng Feng,Gongyue Tang,Xiaowu Zhang,Boon Long Lau,Ming Chinq Jong,Keng Yuen Jason Au, Jun Wei Javier Ong,King Jien Chui, Jun Li,Hongying Li,Duc Vinh Le,Jing Lou
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYno. 3 (2024): 397-405
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Development of Large RDL Interposer Package using RDL-first FOWLP Process
Soon Wee Ho,Siew Boon Soh,Boon Long Lau,Hsiao Hsiang-Yao,Vempati Srinivasa Rao
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.29-34, (2023)
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Numerical and Experimental Investigation of Package Warpage of Large Mold-First FOWLP
Xiaowu Zhang,Sharon Pei Siang Lim,Boon Long Lau, Yong Han,Ming Chinq Jong,Xiaobai Wang,Songlin Liu
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.734-737, (2023)
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3D Stacking of Heterogeneous Chiplets on Modified FOWLP Platform with Thru-Silicon Redistribution Layer
Chai Tai Chong,Lau Boon Long,Sharon Lim Pei Siang,David Ho Soon Wee, Rob van Kampen,Paul Castillou,Roberto Gaddi, Lance Barron,Mickael Renault, Jay Ko, Jonathan Hammond
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.24-28, (2023)
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