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个人简介
Boogyo Sim (S'19) received the B.S. degree in electrical engineering and the M.S. degree in electrical engineering from the Korea Advanced Institute of Science and Technology, Daejeon, South Korea, in 2017 and 2019, respectively, where he is currently working toward the Ph.D. degree in electrical engineering.
His current research interests include design, analysis, and modeling of the wireless power transfer system with high efficiency and low electromagnetic interference.
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论文共 58 篇作者统计合作学者相似作者
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2024): 1-1
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITYno. 1 (2024): 256-269
2023 20TH INTERNATIONAL SOC DESIGN CONFERENCE, ISOCCpp.213-214, (2023)
2023 IEEE WIRELESS POWER TECHNOLOGY CONFERENCE AND EXPO, WPTCEpp.1-5, (2023)
2023 IEEE 32ND CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, EPEPSpp.1-3, (2023)
2023 IEEE 32ND CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, EPEPSpp.1-3, (2023)
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITYno. 6 (2023): 1674-1683
Hyunwoo Kim,Seonguk Choi,Joonsang Park,Haeyeon Kim,Kceyoung Son,Junghyun Lee,Jiwon Yoon, Jonghyun Hong,Boogyo Sim,Keunwoo Kim, Tacit' Shin,Joungho Kim
2023 IEEE 32ND CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, EPEPSpp.1-3, (2023)
Seongguk Kim,Keeyoung Son, Jiwon Yoon,Taein Shin,Keunwoo Kim,Boogyo Sim, Joonsang Park, Seonguk Cho,Jihun Kim,Haeyeon Kim,Joungho Kim,Hyunwook Park
2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)pp.1-3, (2023)
Keeyoung Son, Joonsang Park,Seongguk Kim,Boogyo Sim,Keunwoo Kim,Seonguk Choi, Hyunsik Kim,Joungho Kim
2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)pp.1-3, (2023)
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