基本信息
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Career Trajectory
Bio
Bo Wu (S’12–M’16) received the B.S. degree in electrical engineering from the University of Science and Technology of China, Hefei, China, in 2007, the M.Sc. degree in microelectronics from the Delft University of Technology (TU Delft), Delft, The Netherlands, in 2010, and the Ph.D. degree in electrical engineering from The University of Texas at Dallas, Richardson, TX, USA, in 2015.
From 2009 to 2010, he was an Intern with NXP Semiconductors, Nijmegen, The Netherlands, where he designed a highly linear LNA for base station. He joined Broadcom Ltd., Santa Clara, CA, USA, in 2016, where he has been focusing on the high-speed link design. His current research interests include mixed-signal integrated circuit design primarily as data converters and link transceivers for high-speed communications.
Dr. Wu was a recipient of the NXP Fellowship from TU Delft in 2007 and 2008, the Analog Devices Outstanding Student Designer Award in 2012, and the CICC Student Scholarship Award in 2014.
Research Interests
Papers共 13 篇Author StatisticsCo-AuthorSimilar Experts
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2016 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE (ISSCC) (2016)
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IEEE Journal of Solid-state Circuitsno. 12 (2016): 2893-2905
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Author Statistics
#Papers: 12
#Citation: 277
H-Index: 8
G-Index: 12
Sociability: 3
Diversity: 1
Activity: 0
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