基本信息
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职业迁徙
个人简介
Biyun Ling was born in Jiangsu, China. He received the B.E. degree in aircraft design and engineering and the M.E. degree in measuring and testing technologies and instruments from the Nanjing University of Aeronautics and Astronautics, Nanjing, Jiangsu, China, in 2012 and 2015, respectively, and the Ph.D. degree in microelectronics and solid-state electronics from the Institute of Electronics, Chinese Academy of Sciences, Beijing, China, in 2019.
He is currently a Research Assistant with the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China. His current research interests focus on MMA and its packaging, electret-based MEMS, and TSV.
研究兴趣
论文共 19 篇作者统计合作学者相似作者
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IEEE SENSORS JOURNALno. 2 (2024): 1624-1632
CoRR (2024)
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2024 IEEE 37TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, MEMSpp.697-700, (2024)
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYno. 3 (2024): 359-367
2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)pp.445-448, (2023)
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2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)pp.1527-1530, (2023)
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作者统计
#Papers: 19
#Citation: 75
H-Index: 5
G-Index: 8
Sociability: 3
Diversity: 2
Activity: 4
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