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Bahgat Sammakia, a SUNY distinguished professor of mechanical engineering, is the vice president for research at Binghamton University. A former IBM senior technical staff member, Sammakia joined Binghamton’s faculty in 1998. He is the founding director of the Small Scale Systems Integration and Packaging Center, a New York State Center of Excellence, and is the director of the Energy Efficient Electronic Systems Center, an NSF IUCRC founded in 2011 with a focus on reducing the energy consumed by data centers around the world. Sammakia earned his bachelor’s degree from the University of Alexandria in Egypt and his master’s and doctoral degrees from the University at Buffalo. He is a fellow of the American Society of Mechanical Engineers, the National Academy of inventors, and the IEEE. Sammakia holds 21 U.S. patents and has published more than 250 peer-reviewed technical papers. Sammakia, who received the SUNY Chancellor’s Award for Excellence in Scholarship and Creative Activities in 2010, was honored with the 2010 ITherm Achievement Award for his contributions to the field of semiconductor thermal management.
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Journal of Electronic Packagingpp.1-17, (2024)
APPLIED THERMAL ENGINEERING (2024): 122122
International Journal of Heat and Mass Transfer (2024): 125518
Ghazal Mohsenian,Yaman Manaserh,Mohammad Tradat, Srikanth Rangarjan,Ayushman Singh, Koroush Nemati,Alfonso Ortega,Bahgat Sammakia
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-9, (2023)
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Ali Heydari,Ahmad R Gharaibeh, Mohammed Tradat,Yaman Manaserh, Qusai Soud,Vahideh Radmard,Bahareh Eslami,Jeremy Rodriguez,Bahgat Sammakia
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-5, (2023)
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Ali Heydari, Qusai Soud,Mohammad Tradat,Ahmad Gharaibeh, Naimeh Fallahtafti,Pardeep Shahi,Jeremy Rodriguez,Bahgat Sammakia
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-5, (2023)
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Engineeringno. 7 (2023): 185-197
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