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At IBM, he has led the design and demonstration of the world’s first reported silicon-based 5G phased array IC, a low power 60-GHz CMOS transceiver IC for 802.11ad communications, a 256-element 5G phased array IC and module, a software-defined phased array radio, and several low phase noise frequency synthesizers. He has authored and coauthored more than 60 peer-reviewed papers, the book Cognitive Radio Receiver Front-Ends (Springer, 2014), and several book chapters. He also holds more than 70 issued U.S. patents. Dr. Sadhu currently serves as an IEEE MTT-S Distinguished Microwave Lecturer, Sub-Committee Chair and Steering Committee Member for IEEE RFIC Symposium, TPC member for IEEE ISSCC, and has served as a Guest Editor of IEEE JSSC in 2017 and IEEE T-MTT in 2021.
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IEEE JOURNAL OF SOLID-STATE CIRCUITSno. 99 (2024): 1-17
Chihiro Kamidaki, Yuma Okuyama,Tatsuo Kubo,Wooram Lee,Caglar Ozdag,Bodhisatwa Sadhu,Yo Yamaguchi,Ning Guan
IEICE Trans. Electron.no. 11 (2023): 625-634
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Chihiro Kamidaki, Yuma Okuyama, Tatsuo Kubo, Wooram Lee, Caglar Ozdag,Bodhisatwa Sadhu,Yo Yamaguchi,Ning Guan
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.467-474, (2023)
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2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.2101-2107, (2023)
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2022 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (AP-S/URSI)pp.1278-1279, (2022)
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Chihiro Kamidaki, Yuma Okuyama, Tatsuo Kubo,Wooram Lee,Caglar Ozdag,Bodhisatwa Sadhu,Yo Yamaguchi,Ning Guan
2022 ASIA-PACIFIC MICROWAVE CONFERENCE (APMC)pp.273-275, (2022)
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