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Research Interests
Advanced characterizations of semiconductor packaging materials
Reliability analysis of semiconductor packaging, including solder joints
Adhesion analysis of critical interfaces in photonic and semiconductor devices
Advanced uncertainty propagation analysis for small event probability: Reliability analysis considering inherent manufacturing variabilities
Condition monitoring of automotive smart systems
Moisture and gas diffusion analysis of semiconductor packages and packaging materials
Hermeticity testing and analysis of MEMS devices
Experimental micro and nanomechanics (development of optical methods and methodologies)
High power laser diode (LD) arrays for industrial and military applications: Optical characterization, cryogenic cooling, reliability assessment, etc.
High power light emitting diodes (LEDs): Design and reliability assessment of LEDs and LED-based luminaires
Advanced characterizations of semiconductor packaging materials
Reliability analysis of semiconductor packaging, including solder joints
Adhesion analysis of critical interfaces in photonic and semiconductor devices
Advanced uncertainty propagation analysis for small event probability: Reliability analysis considering inherent manufacturing variabilities
Condition monitoring of automotive smart systems
Moisture and gas diffusion analysis of semiconductor packages and packaging materials
Hermeticity testing and analysis of MEMS devices
Experimental micro and nanomechanics (development of optical methods and methodologies)
High power laser diode (LD) arrays for industrial and military applications: Optical characterization, cryogenic cooling, reliability assessment, etc.
High power light emitting diodes (LEDs): Design and reliability assessment of LEDs and LED-based luminaires
研究兴趣
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2024): 1-1
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.2093-2100, (2023)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.2001-2006, (2023)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1319-1326, (2023)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.814-819, (2023)
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022)
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Reliability of Organic Compounds in Microelectronics and Optoelectronicspp.53-80, (2022)
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