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Papers共 15 篇Author StatisticsCo-AuthorSimilar Experts
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2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1932-1938, (2023)
ADVANCED ENGINEERING MATERIALSno. 20 (2023)
Behnam Garakani,Udara S. Somarathna,Ashraf Umar,Gurvinder Singh Khinda,Mohamed Youssef M. Abdelatty,El Mehdi Abbara, Sari Al Zerey, Mike Hopkins, Sai Srinivas,Chuck Kinzel, Christopher Halseth,Mark Ronay,
Journal of electronic packagingno. 3 (2023)
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1524-1530, (2022)
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1629-1636, (2022)
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.762-768, (2022)
Flexible and Printed Electronicsno. 1 (2022)
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1422-1429, (2022)
Emuobosan Enakerakpo,Mohammed Alhendi,Gurvinder Singh Khinda,Behnam Garakani,K. Udara Sandekelum Somarathna, Mark Poliks,Stephen Gonya, Venugopala Basava
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.1138-1143, (2021)
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.2285-2292, (2021)
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Author Statistics
#Papers: 10
#Citation: 54
H-Index: 5
G-Index: 7
Sociability: 4
Diversity: 0
Activity: 0
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