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Avram Bar-Cohen (Life Fellow, IEEE) was an Internationally Recognized Leader of Thermal Science and Technology, an Honorary Member of the ASME, and a Principal Engineering Fellow with Raytheon Corporation-Space and Airborne Systems, Arlington, VA, USA. His research interests included on-chip thermoelectric and two-phase microchannel coolers for high-heat-flux electronic components, thermal control of directed energy systems, and studies of wireless power beaming.
Dr. Bar-Cohen served on the Board of Governors of the IEEE CPMT Society. He was the Editor-in-Chief of the Encyclopedia of Thermal Packaging (WSPC) and the Coeditor of the Advanced Integration and Packaging (WSPC) book series.
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