Andrew Cross - Process Control Solutions (PCS), KLA Corporation

基本信息

Career Trajectory

Bio

Andrew Cross is a Director in KLA-Tencor Process Control Solutions group responsible for defect inspection and reduction methodology development. His experience includes working in the areas yield improvement, device engineering, process integration, data analysis, defect inspection strategy and defect reduction. Andrew has a BSc. in Electronics from the University of Durham, UK.

Research Interests

Papers共 37 篇Author StatisticsCo-AuthorSimilar Experts

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Hotspot Discovery and Variability Analysis for Advanced EUV Processes

Kaushik Sah, Zhijin Chen, Yao Zhang, Liming Zhang, Cao Zhang,Craig Higgins,Anatoly Burov,Guy Parsey,Pradeep Vukkadala,Roel Gronheid, Arpit Jain, Ramakanth Ramini, Ankur Agrawal, Garima Sharma,Andrew Cross,Syamashree Roy,Victor Blanco

METROLOGY, INSPECTION, AND PROCESS CONTROL XXXVIII (2024)

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Novel Ellipsometry Metrology-Based Machine Learning Technique for Low Sensitivity Characterization of Critical Dimensions Within Gate-All-around Transistors

Houssam Chouaib, Valeria Dimastrodonato, Anderson Chou, Agostino Cangiano,Andrew Cross,Derrick Shaughnessy,Zhengquan Tan,Daniel Schmidt,Curtis Durfee,Shanti Pancharatnam,Julien Frougier,Andrew Greene,Mary Breton

METROLOGY, INSPECTION, AND PROCESS CONTROL XXXVIII (2024)

Cited1Views0Bibtex

Pushing the Boundaries of Random Logic Metal Patterning with Low-N EUV Single Exposure

Syamashree Roy,Arame Thiam,Kaushik Sah,Yannick Feurprier, Nobuyuki Fukui,Kathleen Nafus,Kenichi Miyaguchi,Dieter Van Den Heuvel,Balakumar Baskaran,Joost Bekaert,Andrew Cross,Mircea Dusa,Victor M. Blanco Carballo

OPTICAL AND EUV NANOLITHOGRAPHY XXXVII（2024）

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Single Mask Solution to Pattern BLP and SNLP Using 0.33NA EUV for Next-Generation DRAM Manufacturing

Kaushik Sah,Andrew Cross,Sayantan Das,Roberto Fallica,Jeonghoon Lee,Ryoung-Han Kim,Sandip Halder,Ethan Maguire,Ana-Maria Armeanu,Monica Sears,Neal Lafferty,Vlad Liubich,Chih- Wei,Germain Fenger

DTCO and Computational Patterning II (2023)

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Rigorous 3D Probabilistic Computational Lithography and Chip-Level Inspection for EUV Stochastic Failure Detection

Eunju Kim,Wooseok Kim, Jonggwan Lee, Seongjong Kim, Sukyong Lee, Nohong Kwak, Mincheol Kang, Yongchul Jeong, Myungsoo Hwang,Changmin Park,Kyoil Koo, Seongtae Jeong,John Biafore,Mark Smith,Trey Graves,Anatoly Burov,Pradeep Vukkadala,Guy Parsey, Cao Zhang, Kunlun Bai,Janez Krek,Craig Higgins, Sergei Bakarian, Kyeongeun Ko,Roel Gronheid,Kaushik Sah,Andrew Cross, Yi Liu,Alessandro Vaglio Pret, Chris Walker,Vikram Tolani,George Hwa,Peter Hu, Chang Song, Alex Arkhipov,Loemba Bouckou, Chi-Ping Liu, Xiaochun Yang, Kana O'Hara,Donghwan Son

INTERNATIONAL CONFERENCE ON EXTREME ULTRAVIOLET LITHOGRAPHY 2023 (2023)

Cited1Views0Bibtex

EUV Based Multi-Patterning Schemes for Advanced DRAM Nodes

Sayantan Das,Kaushik Sah,Roberto Fallica, Zhijin Chen,Sandip Halder,Andrew Cross,Danilo De Simone, Fergo Treska,Philippe Leray,Ryoung Han Kim,Ethan Maguire,Chih- Wei,Germain Fenger,Neal Lafferty,Jeonghoon Lee

ADVANCES IN PATTERNING MATERIALS AND PROCESSES XXXIX（2022）

Cited2Views0Bibtex

Exploring the Stochastics Cliff: Understanding the Impact of LER/LWR to Stochastic Defectivity and Yield

Jennifer Church, Graham Jensen,Romain Lallement,Andrew Cross,Luciana Meli

INTERNATIONAL CONFERENCE ON EXTREME ULTRAVIOLET LITHOGRAPHY 2021（2021）

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Defect Characterization of 28 Nm Pitch EUV Single Patterning Structures for In5 Node

Kaushik Sah,Sayantan Das,Andrew Cross, Kay Peng,Kha Tran,Binesh Babu, Ardis Liang,Danilo De Simone,Philippe Leray,Sandip Halder

Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV (2021)

Cited4Views0Bibtex

Defect Characterization of EUV Self-Aligned Litho-Etch Litho-Etch (SALELE) Patterning Scheme for Advanced Nodes

Kaushik Sah,Andrew Cross,Sayantan Das,Victor Blanco,Luka Kljucar,Sandip Halder,Philippe Leray

Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV (2021)

Cited0Views0Bibtex

Deep learning-based defect detection using large FOV SEM for 28 nm pitch BEOL layer patterned with 0.33NA single exposure EUV

Sayantan Das,Kaushik Sah, Ardis Liang,Hemanta Roy,Kha Tran,Binesh Babu, Arjun Hegde,Andrew Cross,Philippe Leray,Sandip Halder

International Conference on Extreme Ultraviolet Lithography 2021 (2021): 82-92

Cited2Views0Bibtex

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