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Papers共 123 篇Author StatisticsCo-AuthorSimilar Experts
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2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)no. EMPC (2023): 1-6
2022 IEEE 9TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, ESTCpp.603-609, (2022)
David Schutze, Marcus Voitel, Stefan Gottwald,Malte Spanier,Karl-Friedrich Becker,Andreas Ostmann,Thomas Loher, Andreas Hofmeister,Martin Schneider-Ramelow
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)pp.49-54, (2022)
2021 51st European Microwave Conference (EuMC)pp.10-13, (2022)
2022 IEEE CPMT Symposium Japan (ICSJ)pp.21-24, (2022)
Malte Spanier, Jakub Pawlikowski,Steffen Ziesche,Holger Kappert,Andreas Ostmann,Martin Jaegle,Martin Schneider-Ramelow
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)pp.145-149, (2022)
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)pp.425-429, (2022)
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)pp.1-7, (2021)
Friedrich-Leonhard Schein,Ruben Kahle, Marc Kunz,Tim Kunz, Jordan Kossev,Tobias Muller, Mathias Pentz,Michael Dietterle,Andreas Ostmann
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 1 (2020): 1-1
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