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Papers共 27 篇Author StatisticsCo-AuthorSimilar Experts
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Koen Kennes, Ye Lin,Samuel Suhard,Pieter Bex,Dieter H. Cuypers,Alice Guerrero, Dennis Bumueller,Alain Phommahaxay,Gerald Beyer,Eric Beyne
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.637-642, (2024)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1584-1589, (2023)
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)pp.1584-1589, (2023)
Koen Kennes,Alain Phommahaxay,Alice Guerrero,Samuel Suhard,Pieter Bex,Steven Brems,Xiao Liu, Sebastian Tussing,Gerald Beyer,Eric Beyne
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.2058-2063, (2022)
Koen Kennes,Alain Phommahaxay,Alice Guerrero, Dennis Bumueller,Samuel Suhard, Pieter Bex, Sebastian Tussing,Xiao Liu, Gerald Beyer,Eric Beyne
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.2126-2133, (2021)
Alice Guerrero,Pieter Bex, Andrew M. Jones,Arthur Southard, Daojie Dong,Alain Phommahaxay,Eric Beyne
International Symposium on Microelectronicsno. 1 (2021): 000060-000066
Koen Kennes,Alain Phommahaxay,Alice Guerrero, Olga Bauder,Samuel Suhard,Pieter Bex,Serena Iacovo,Xiao Liu, Thomas Schmidt,Gerald Beyer,Eric Beyne
Arnita Podpod,Alain Phommahaxay,Pieter Bex,John Slabbekoorn,Julien Bertheau, Abdellah Salahoueldhadj,Erik Sleeckx,Andy Miller,Gerald Beyer,Eric Beyne,Alice Guerrero,Kim Yess,
2019 International Wafer Level Packaging Conference (IWLPC)pp.1-6, (2019)
2019 International Wafer Level Packaging Conference (IWLPC)pp.1-8, (2019)
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