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Alexander Göritz studied electrical engineering (microelectronics–semiconductor technology) at Technical University Dresden, Dresden, Germany, where he received the Dipl.-Ing. degree in 2011.
In 2012, he joined the Technology Department, IHP–Leibniz-Institut für innovative Mikro-elektronik, Frankfurt, Germany, and started to work on the development of RF-microelectro-mechanical-system (MEMS) for millimeter-wave (mm-wave) applications and their wafer-level thin-film encapsulation. In order to release the established MEMS devices, he applies and optimizes the MEMS releasing processes (wet chemical etching, HF vapor phase etching). Since 2014, his field of work is expanded by further tasks related to the development and application of general back-end-of-line (BEOL) process flows to realize BEOL wafers for passive devices in cost-efficient test platforms.
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 6 (2022): 921-932
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