基本信息
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Bio
My major research interest is in understanding the inter-relationships between processing, microstructure and properties in materials; with an emphasis on mechanical, electrical and magnetic applications. Present research focus is on lightweight structures for land, sea and air transportation applications. Projects include incremental forming of sheet metal and nano-particle additions to aluminum alloys. For polymer composites, we are studying the effect of carbon nanotube and graphene additions to polymer composites utilizing electrical and magnetic fields to produce oriented particles for improved mechanical properties.
I am also the Chief Technology Officer for LIFT (Lightweight Innovations for Tomorrow) which is a new lightweight metals manufacturing innovation institute. LIFT is a $150M public-private partnership developing new manufacturing processes for lightweight metals (AHSS, Al, Mg, Ti). The Institute is located in Detroit, MI and conducts research on industry-relevant applications with LIFT members from academia, industry and federal laboratories.
Research Interests
Papers共 135 篇Author StatisticsCo-AuthorSimilar Experts
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Anita Li,Michael P. Balogh, Nathan Thompson, William Osad, Andrew Galant, Alex Millerman,Chuanlong Wang,Alan Taub
JOURNAL OF THE ELECTROCHEMICAL SOCIETYno. 3 (2024)
Amy Langhorst, Dandan Zhang, Jonah Berman, Xhulja Biraku,Julie Rieland,Mengjie Yu,Brian Love,Mihaela Banu,Alan Taub
Scientific Reportsno. 1 (2024): 1-16
Aaron Gladstein, Shanmukha Kiran Aramanda, Lingxia Shi, Jason Landini,Jonathan Goettsch, Caleb Reese, Bibhu Sahu, Xianghui Xiao,Allen Hunter,Katsuyo Thornton,Ashwin J. Shahani,Alan I. Taub
Acta Materialiapp.120189, (2024)
Journal of Manufacturing Processes (2023): 143-151
Journal of alloys and compounds (2023): 169405-169405
Light Metals 2023pp.451-456, (2023)
Materials science and engineering A, Structural materials proporties, microstructures and processing/Materials science & engineering A, Structural materials properties, microstructure and processing (2023): 145437-145437
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)pp.218-218, (2023)
INDUSTRIAL CROPS AND PRODUCTS (2023)
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Author Statistics
#Papers: 134
#Citation: 3751
H-Index: 30
G-Index: 58
Sociability: 5
Diversity: 0
Activity: 1
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