基本信息
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Bio
Arun Gowda received the Ph.D. degree in electronics manufacturing field from Binghamton University, Binghamton, NY, USA, in 2004.
He led the Electronics Packaging and Miniaturization Laboratory at GE Research, responsible for the development of advanced packaging and integration of microelectronics, sensors, and power devices. He has 16 years of GE experience spanning various technical contributor, project leadership, and people management roles. He is the SiC Mission Leader and the Principal Engineer responsible for packaging development and deployment of GE’s SiC technology into applications. He is a Six Sigma Black Belt and a TRIZ Level 3 Practitioner. He has experience in the areas of electronics packaging, heterogeneous integration, electronic materials, thermal management, and electronics manufacturing processes.
Research Interests
Papers共 67 篇Author StatisticsCo-AuthorSimilar Experts
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 5 (2023): 638-645
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.668-675, (2023)
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1738-1744, (2022)
ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2020)
Liang Yin,Kaustubh Ravindra Nagarkar,Arun Virupaksha Gowda,Christopher James Kapusta,Risto Tuominen,Paul Jeffrey Gillespie, Donna Marie Sherman, Tammy Lynn Johnson,Shingo Hayashibe,Hitoshi Ito,Tadashi Arai
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Author Statistics
#Papers: 67
#Citation: 1217
H-Index: 24
G-Index: 28
Sociability: 5
Diversity: 0
Activity: 0
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