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Bio
Dr. Yanan Sun is currently anAssociate Professor in the Department of Micro-Nano Electronics at Shanghai Jiao Tong University. She received the B.E. degree in Microelectronics from Shanghai Jiao Tong University in 2009, and the Ph.D. degree in Electronic and Computer Engineering from the Hong Kong University of Science and Technology in 2015.Dr. Sun’s current research is focused on low-power and high-yield integrated circuit and system design with emerging nanoscale transistor and memory technologies (such as carbon nanotube transistors and non-volatile memories). She also has interests in 3D integration circuit design with high-speed interconnect techniques and theapplications of machine-learning/emerging technologies for robust integrated circuits. Her research works are published in the international journals, such as IEEETCAS-I, TCAS-II, TED, TVLSI, and TDMR, as well as the international conferences, such as ISCAS, ISOCC, and ICM. In 2014, she received the best paper award (first place) in the IEEE International Conference on Microelectronics (ICM). Dr. Sun is a member of IEEE. She also served as a reviewer for multiple international journals and conferences. She serves as an associate editor on the editorial boards of the Microelectronics Journalsince 2015.
Research Interests
Papers共 93 篇Author StatisticsCo-AuthorSimilar Experts
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Xuepei Wang,BoYao Cui, Lingling Jing,Xiaolin Wang,Maokun Wu, Yicheng Wen,Yishan Wu,Jinhao Liu, Feilong Zhang, Zidong Lin,Yanan Sun,Pengpeng Ren,
IEEE TRANSACTIONS ON ELECTRON DEVICESno. 4 (2024): 2404-2410
2024 Conference of Science and Technology for Integrated Circuits (CSTIC)pp.1-3, (2024)
IEEE Journal of Solid-state Circuitsno. 2 (2024): 616-625
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systemsno. 3 (2023): 1015-1028
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERSno. 5 (2023): 2048-2061
2023 IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER AIDED DESIGN, ICCAD (2023): 1-9
2023 DESIGN, AUTOMATION & TEST IN EUROPE CONFERENCE & EXHIBITION, DATEpp.1-2, (2023)
wos(2023)
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