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个人简介
Daoguo Yang received the M.Sc. degree in engineering mechanics from Zhejiang University, Hangzhou, China and is currently pursuing the Ph.D. degree at Delft University of Technology, Delft, The Netherlands.
He used to be with the Guilin University of Electronic Technology, Guangxi, China, as a Lecturer and Associate Professor. He is currently a Research Fellow with the Delft University of Technology. His research interests are in the areas of finite element modeling, experimental mechanics, reliability of microelectronic packaging and assembly, damage, and failure mechanism of electronic packaging and interconnection materials.
研究兴趣
论文共 306 篇作者统计合作学者相似作者
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IEEE transactions on instrumentation and measurement (2024): 1-8
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITYno. 1 (2024): 129-141
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-4, (2023)
Moleculesno. 18 (2023): 6514-6514
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-5, (2023)
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-6, (2023)
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-5, (2023)
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-6, (2023)
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-5, (2023)
2022 19th China International Forum on Solid State Lighting & 2022 8th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS)pp.121-124, (2023)
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作者统计
#Papers: 303
#Citation: 3112
H-Index: 26
G-Index: 48
Sociability: 6
Diversity: 3
Activity: 55
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